Semiconductor
/ Electronic Devices
Blueacre
Technology has experience with laser micromachining of semiconductor devices
on various substrates. Processes include dicing, scribing and drilling
of vias in Silicon. Other applications include PCB etching as well as
production of flexible circuits.
Feature sizes of 20 microns are easily achievable while smaller feature
sizes (down to 1 micron) can be obtained using specialised processes
Modification
of micro circuitry detail on silicon wafer
2mm x 2.5mm die size
SEM image of laser cut edge of 250 micron thick silicon wafer
SEM image of laser cut edge of 250 micron thick silicon wafer
35mm x 30 mm dimensions
Single sided board for surface mount and through hole devices
8.5 Mb
Flexible
circuits for heating cicuitry and wearable electronics
Sample shows laser etched 200nm layer of titanium on 75 microns of polyester